Vertiv Introduces New Flexible, High-Density Heat Rejection System to Support Hybrid Liquid and Air Cooling for AI Applications

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The Vertiv™ CoolLoop Trim Cooler is an energy-efficient and space-saving solution designed to operate with fluctuating water temperatures common to AI and HPC applications

Vertiv Introduces New Flexible, High-Density Heat Rejection System to Support Hybrid Liquid and Air Cooling for AI Applications

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Brianna Rabe
Brianna.Rabe@RuderFinn.com

Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, today made another key addition to its industry-leading thermal management portfolio, with the introduction of the Vertiv™ CoolLoop Trim Cooler, in support of air and liquid cooling applications for AI (artificial intelligence) and HPC (high-performance computing). This global solution supports diverse climate conditions for hybrid-cooled or liquid-cooled data centers and AI factories.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250305050013/en/

(Photo: Business Wire)

(Photo: Business Wire)

Integrating seamlessly with high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and aligns with the industry's evolving needs for energy-efficient and compact cooling solutions. It provides up to a 70% reduction in annual cooling energy consumption, leveraging free-cooling and mechanical operation, and 40% space savings compared to traditional systems. Designed to address the challenges of modern AI factories, the system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C.

Straightforward water connections provide smooth and direct system integration for the Vertiv CoolLoop Trim Cooler and the Vertiv™ CoolChip CDU coolant distribution units, for direct-to-chip cooling. Vertiv CoolLoop Trim Cooler can also connect directly to immersion cooling systems. This simplifies installation and operational complexity, allowing compatibility across a range of high-density cooling environments, offering time savings and cost efficiencies for customers.

“AI is dramatically changing the cooling profiles of today’s data centres, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, thermal business EMEA at Vertiv. “Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”

The Vertiv™ CoolLoop Trim Cooler uses low-GWP refrigerant and offers a scalable cooling capacity up to almost 3 MW in the air-cooled configuration. With free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions, for reduced electrical consumption and CO2e emissions. It is compliant with 2027 EU F-GAS regulations ban, avoiding the need for costly redesigns or infrastructure upgrades to meet this upcoming regulatory requirement.

For more information on the Vertiv CoolLoop Trim Cooler, Vertiv CoolChip CDU family or other Vertiv solutions to enable AI acceleration, visit Vertiv.com.

About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics and ongoing services to enable its customers’ vital applications to run continuously, perform optimally and grow with their business needs. Vertiv solves the most important challenges facing today’s data centres, communication networks and commercial and industrial facilities with a portfolio of power, cooling and IT infrastructure solutions and services that extends from the cloud to the edge of the network. Headquartered in Westerville, Ohio, USA, Vertiv does business in more than 130 countries. For more information, and for the latest news and content from Vertiv, visit Vertiv.com.

Forward-Looking Statements
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27 of the Securities Act, and Section 21E of the Securities Exchange Act. These statements are only a prediction. Actual events or results may differ materially from those in the forward-looking statements set forth herein. Readers are referred to Vertiv’s filings with the Securities and Exchange Commission, including its most recent Annual Report on Form 10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion of these and other important risk factors concerning Vertiv and its operations. Vertiv is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.